Phoenix Microme|x Neo y Nanome|x Neo

Phoenix Microme | x Neo y Nanome | x Neo proporcionan tecnología de rayos X 2D de alta resolución, escaneo PlanarCT y tomografía computarizada (CT) 3D en un solo sistema, lo que permite realizar pruebas no destructivas (NDT) de componentes electrónicos, como semiconductores, PCB, baterías de iones de litio: en las industrias industrial, automotriz, de aviación y electrónica de consumo. Con una ingeniería innovadora junto con una precisión de posicionamiento ultra alta, Phoenix Microme | x Neo y Nanome | x Neo son ideales para inspecciones de electrónica industrial de rayos X en proceso y control de calidad para una mayor productividad, análisis de fallas para una mayor seguridad y calidad de su productos e I + D donde nacen las innovaciones.

Principales características

Resolución de píxeles superior (85 / 100μm) nuevos detectores más competentes para semiconductores e inspección de componentes electrónicos diminutos
Facilidad de uso: informe de inspección que se genera automáticamente después de la inspección
Paquete x | act para programación μAXI basada en CAD e inspección automática diamante | ventana para una adquisición de datos hasta 2 veces más rápida con el mismo nivel de alta calidad de imagen
Opcionalmente, escaneos de tomografía computarizada 3D en 10 segundos

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Especificaciones técnicas

nanome\|x neo 180	microme\|x neo 180	microme\|x neo 160
X-ray detector	Option 1: Waygate Technologies high dynamic 200 μm pixel resolution detector Option 2: Superior 100 μm pixel resolution detector	Option 1: Superior 85 μm pixel resolution αSi detector Option 2: Superior 75 μm pixel resolution CMOS detector
Geometric magnification	max. 1,970x
Total magnification 27” Monitor	max. 2,700x	max. 7,200 x
Total magnific. 27” 2K Monitor	max. 2,300x	max. 6,000x
Detail detectability	up to 0.2 μm	up to 0.5 μm
X-ray tube type	Low maintenance open nanofocus tube with unlimited lifetime, transmission type, 170° cone angle, collimated	Low maintenance open microfocus tube with unlimited lifetime, transmission type, 170° cone angle, collimated
Max. tube voltage/power on target	180 kV / 15 W	180 kV / 20 W	160 kV / 20 W
Max. tube voltage/power on target	Diamond\|window for up to 2 times faster data acquisition as the same high image quality level
Filament	Tungsten hairpin, pre-adjusted in plug-in cartridges for fast and easy exchange
Manipulator	high-precision vibration-free synchronized 5-axes manipulation
Max. inspection area	460 mm x 360 mm (18” x 14”), 610 mm x 510 mm (24” x 20”) without rotation table
Max. sample size / weight	680 mm x 635 mm (27” x 25”) / 10 kg (22 lbs.)
ovhm – oblique view rotation	continuously adjustable view angle up to 70°, rotation 0° – 360°
Control	Joystick or mouse control (manual mode) and CNC (automatic mode)
Manipulation aids	sample X-ray mapping, click’n-move-to function, click’n-zoom-to function, automatic isocentric manipulator movement
Positioning aid	laser crosshair	laser crosshair optional
Anti-Collision System	may be deactivated for maximum magnification (tube touching the sample)
System dimensions (W x H x D)	2,160 mm x 1,920 mm x 1,590 mm (85” x 75.6” x 62.6”), (without control console)
Min. transportation width:	1,590 mm (62.6”) (without control console)
Max. weight	appr. 3,100 kg / 6,835 lbs.
Radiation safety	The radiation safety cabinet is a full protective installation without type approval according to the German RöV and the US Performance Standard 21 CFR, Subchapter J. For operation, other official licenses may be necessary
Image processing software	phoenix x\|act: comprehensive CAD based X-ray inspection software comprising image enhancement functions, measuring functions and fast and easy automated CAD based programming for automatic inspection bga\|module (standard): Intuitive automatic view based BGA solder-joint evaluation incl. automatic wetting analysis vc\|module (standard): Intuitive automatic view based voiding calculation software package incl. capability of multiple die attach voiding evaluation
Software Configuration (Option)	x\|act BGA check strategy: automated CAD based analysis of BGA solder jointsx\|act PTH check strategy: automated CAD based analysis of PTH solder jointsqfp\|module: automated QFP solder joint evaluationqfn\|module: automated inspection of QFN / MLF solder jointspth\|module: automated pin-through-hole solder joint evaluationc4\|module: view based evaluation of round solder joints with background structure, such as C4 bumpsml\|module: view based registration of multilayer printed circuit boardsquality\|review: visual interface for rework and failure indicationFLASH!™: Waygate’s exclusive image optimization technology
Software Configuration (Option)	planarCT module: Non destructive 2D slice and 3D volume board evaluation incl. 3D\|viewer software
Hardware Configuration (Option)	Tilt / rotate unit: tilt ± 45° and rotation n x 360° for samples up to 2 kg Manual bar code reader: for product identification
Computed Tomography (Option)	Volume acquisition / reconstruction software: phoenix datos\|x Upgrade package for combined 2D / 3D (computed tomography) operation CT-unit: precision rotation axis Max. geom. magnification: 100 x (CT) Max. voxel resolution: down to 2 μm, resolution depending on the sample size. The nanoCT® function of the nanome\|x allows a higher image sharpness