Phoenix Microme | x Neo y Nanome | x Neo proporcionan tecnología de rayos X 2D de alta resolución, escaneo PlanarCT y tomografía computarizada (CT) 3D en un solo sistema, lo que permite realizar pruebas no destructivas (NDT) de componentes electrónicos, como semiconductores, PCB, baterías de iones de litio: en las industrias industrial, automotriz, de aviación y electrónica de consumo. Con una ingeniería innovadora junto con una precisión de posicionamiento ultra alta, Phoenix Microme | x Neo y Nanome | x Neo son ideales para inspecciones de electrónica industrial de rayos X en proceso y control de calidad para una mayor productividad, análisis de fallas para una mayor seguridad y calidad de su productos e I + D donde nacen las innovaciones.
Principales características
nanome|x neo 180 | microme|x neo 180 | microme|x neo 160 | |
X-ray detector | Option 1: Waygate Technologies high dynamic 200 μm pixel resolution detector Option 2: Superior 100 μm pixel resolution detector | Option 1: Superior 85 μm pixel resolution αSi detector Option 2: Superior 75 μm pixel resolution CMOS detector | |
Geometric magnification | max. 1,970x | ||
Total magnification 27” Monitor | max. 2,700x | max. 7,200 x | |
Total magnific. 27” 2K Monitor | max. 2,300x | max. 6,000x | |
Detail detectability | up to 0.2 μm | up to 0.5 μm | |
X-ray tube type | Low maintenance open nanofocus tube with unlimited lifetime, transmission type, 170° cone angle, collimated | Low maintenance open microfocus tube with unlimited lifetime, transmission type, 170° cone angle, collimated | |
Max. tube voltage/power on target | 180 kV / 15 W | 180 kV / 20 W | 160 kV / 20 W |
Diamond|window for up to 2 times faster data acquisition as the same high image quality level | |||
Filament | Tungsten hairpin, pre-adjusted in plug-in cartridges for fast and easy exchange | ||
Manipulator | high-precision vibration-free synchronized 5-axes manipulation | ||
Max. inspection area | 460 mm x 360 mm (18” x 14”), 610 mm x 510 mm (24” x 20”) without rotation table | ||
Max. sample size / weight | 680 mm x 635 mm (27” x 25”) / 10 kg (22 lbs.) | ||
ovhm – oblique view rotation | continuously adjustable view angle up to 70°, rotation 0° – 360° | ||
Control | Joystick or mouse control (manual mode) and CNC (automatic mode) | ||
Manipulation aids | sample X-ray mapping, click’n-move-to function, click’n-zoom-to function, automatic isocentric manipulator movement | ||
Positioning aid | laser crosshair | laser crosshair optional | |
Anti-Collision System | may be deactivated for maximum magnification (tube touching the sample) | ||
System dimensions (W x H x D) | 2,160 mm x 1,920 mm x 1,590 mm (85” x 75.6” x 62.6”), (without control console) | ||
Min. transportation width: | 1,590 mm (62.6”) (without control console) | ||
Max. weight | appr. 3,100 kg / 6,835 lbs. | ||
Radiation safety | The radiation safety cabinet is a full protective installation without type approval according to the German RöV and the US Performance Standard 21 CFR, Subchapter J. For operation, other official licenses may be necessary | ||
Image processing software | phoenix x|act: comprehensive CAD based X-ray inspection software comprising image enhancement functions, measuring functions and fast and easy automated CAD based programming for automatic inspection bga|module (standard): Intuitive automatic view based BGA solder-joint evaluation incl. automatic wetting analysis vc|module (standard): Intuitive automatic view based voiding calculation software package incl. capability of multiple die attach voiding evaluation | ||
Software Configuration (Option) | x|act BGA check strategy: automated CAD based analysis of BGA solder jointsx|act PTH check strategy: automated CAD based analysis of PTH solder jointsqfp|module: automated QFP solder joint evaluationqfn|module: automated inspection of QFN / MLF solder jointspth|module: automated pin-through-hole solder joint evaluationc4|module: view based evaluation of round solder joints with background structure, such as C4 bumpsml|module: view based registration of multilayer printed circuit boardsquality|review: visual interface for rework and failure indicationFLASH!™: Waygate’s exclusive image optimization technology | ||
planarCT module: Non destructive 2D slice and 3D volume board evaluation incl. 3D|viewer software | |||
Hardware Configuration (Option) | Tilt / rotate unit: tilt ± 45° and rotation n x 360° for samples up to 2 kg Manual bar code reader: for product identification | ||
Computed Tomography (Option) | Volume acquisition / reconstruction software: phoenix datos|x Upgrade package for combined 2D / 3D (computed tomography) operation CT-unit: precision rotation axis Max. geom. magnification: 100 x (CT) Max. voxel resolution: down to 2 μm, resolution depending on the sample size. The nanoCT® function of the nanome|x allows a higher image sharpness |
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